86-20-34882219
No. 2 Shiling Road, Dongchong Town, Nansha, Gd, Guangzhou, Guangdong, China
Diversified Application
It is applicable for micro-drilling and precise cutting process of all materials, including sapphire glass, tempered glass, ceramic materials, semiconductor materials, high polymer materials, ultra-thin metals and diamond film three-axis motion platform.
Features
1. High cost-performance ratio.
2. User friendly operation interface.
3. Easy to learn and convenient.
4. Laser processing with much less cost than mechanicalcutting.
MicroCut operating system
1. Concise and beautiful.
2. Safety protection.
3. Permission classification operating system.
4. Operating mode much simpler than point-and-shoot camera.
High-end intelligent processing equipment
Low-cost solution
Clean production
Processing without mechanical stress
Laser cutting of diamond film
Laser scribing ceramics
Laser application for biomedical technology
Laser scribing of ITO
Laser drilling and laser cutting of chip and crisp hard material
| Machine model | HMX- UV12SA- 4600 | HMX- UV15SA- 4 | HHMX- UV10HA- 4600 | HMX- GR30WA- 4600 |
| Type of laser | 355nm 12W | 355nm 15W | 355nm 10W | 532nm 30W |
| Single-pass max. working scope | 50x50mm | |||
| Min. focus spot | 20um | 20um | 20um | 30um |
| Max. working scope of laser processing | 460x460mm ( free joining together ) | |||
| Stitching precision processing route | ≤±3um | |||
| Laser processing speed | 100-3000mm/s (adjustable) | |||
| MMaximum moving speed of XY platform | 600/s 1G accelerated speed | |||
| Repeat accuracy of XY platform | ≤±1um | |||
| Location precision of XY platform | ≤±3um | |||
| CCD location precision | ≤±3um | |||
| Feeding methods | Manual | Manual | Manual/automatic (optional) | Manual |
| Cooling method | Air cooling | |||
| Power supply of the whole machine | 5KW / AC220V / 50Hz | |||
| Extenal dimension | 1700mmX1350mmX1850mm | |||
